A STABLE, CONCENTRATABLE SILICON WAFER POLISHING COMPOSITION AND RELATED METHODS

摘要

The present invention provides a stable and concentratable silicon wafer polishing composition including water; an abrasive; cations represented by chemical formula I; piperazine or a piperazine derivative represented by chemical formula II; and optionally a pH adjusting agent, wherein the composition shows at least silicon removal rate of 300 nm/min. Moreover, provided are methods for manufacturing and using a stable and concentratable chemical/mechanical silicon wafer polishing composition.