Light emitting unit, manufacturing method thereof and touch panel having the same

摘要

A manufacturing method of light emitting units is shown below. First step is providing a substrate with multi circuit areas. A light emitting diode is mounted on the circuit area respectively. Next step is forming a package structure to cover the light emitting diode. Next step is dicing the package structure to form a biconic package structure. The package structure is diced twice in two directions, respectively. As above-mentioned, the light emitting unit has asymmetric light radiation pattern.

主权项

1. A manufacturing method of light emitting units comprising steps of:
providing a substrate, the substrate having a plurality of circuit areas and a light emitting device being disposed on each of the circuit areas; respectively forming a dome-shaped packaging structure to cover each of the light emitting devices on the circuit areas, each of the packaging structure comprising a biconic top surface having a central first curvature region and a surrounding second curvature region integrally formed around the first curvature region; singulating the packaging structures by cutting in the second curvature region of each biconic top surface through the substrate along two non-parallel axes to form separated and individual light emitting units, wherein the biconic top surface of each singulated packaging structure remains a bi-curvature profile; wherein each of the light emitting units has an asymmetric lighting pattern in two directions.