发明名称 |
Method of manufacturing silicon carbide structure |
摘要 |
A method of manufacturing a silicon carbide structure includes forming a silicon carbide layer by depositing silicon carbide on a base plate by chemical vapor deposition, removing the base plate, decreasing electrical conductivity by heat-treating the silicon carbide structure, and removing a thickness of 200 μm from an upper surface and a lower surface of the silicon carbide structure. In the present invention, silicon carbide is deposited by a CVD method, and the electrical conductivity of the silicon carbide is reduced to the electrical conductivity required for a protection ring of a plasma device through a post-treatment and a post-process. The electrical conductivity may be adjusted even without using separate additives. |
申请公布号 |
US8865519(B2) |
申请公布日期 |
2014.10.21 |
申请号 |
US201213609622 |
申请日期 |
2012.09.11 |
申请人 |
Tokai Carbon Korea Co., Ltd. |
发明人 |
Kim Joung Il;Lim Jae Seok;Yoon Mi-Ra |
分类号 |
H01L21/02 |
主分类号 |
H01L21/02 |
代理机构 |
Leydig, Voit & Mayer, Ltd. |
代理人 |
Leydig, Voit & Mayer, Ltd. |
主权项 |
1. A method of manufacturing a silicon carbide structure, comprising:
forming a silicon carbide layer on a base plate by chemical vapor deposition; removing the base plate and leaving a silicon carbide structure; heat-treating the silicon carbide structure and decreasing electrical conductivity of the silicon carbide structure; and removing a thickness of at least 200 μm from an upper surface and from a lower surface of the silicon carbide structure. |
地址 |
Gyeonggi-Do KR |