发明名称 Method of manufacturing silicon carbide structure
摘要 A method of manufacturing a silicon carbide structure includes forming a silicon carbide layer by depositing silicon carbide on a base plate by chemical vapor deposition, removing the base plate, decreasing electrical conductivity by heat-treating the silicon carbide structure, and removing a thickness of 200 μm from an upper surface and a lower surface of the silicon carbide structure. In the present invention, silicon carbide is deposited by a CVD method, and the electrical conductivity of the silicon carbide is reduced to the electrical conductivity required for a protection ring of a plasma device through a post-treatment and a post-process. The electrical conductivity may be adjusted even without using separate additives.
申请公布号 US8865519(B2) 申请公布日期 2014.10.21
申请号 US201213609622 申请日期 2012.09.11
申请人 Tokai Carbon Korea Co., Ltd. 发明人 Kim Joung Il;Lim Jae Seok;Yoon Mi-Ra
分类号 H01L21/02 主分类号 H01L21/02
代理机构 Leydig, Voit & Mayer, Ltd. 代理人 Leydig, Voit & Mayer, Ltd.
主权项 1. A method of manufacturing a silicon carbide structure, comprising: forming a silicon carbide layer on a base plate by chemical vapor deposition; removing the base plate and leaving a silicon carbide structure; heat-treating the silicon carbide structure and decreasing electrical conductivity of the silicon carbide structure; and removing a thickness of at least 200 μm from an upper surface and from a lower surface of the silicon carbide structure.
地址 Gyeonggi-Do KR