发明名称 Spatial structure with a transponder and method for the manufacture thereof
摘要 A spatial structure having a transponder comprising a planar antenna (6) and a chip (3) connected to the antenna (6), wherein the antenna (6) is at least partially embedded in a planar thermoplastic material (5) of the spatial structure, and a cavity is provided in the thermoplastic material (5) for partial holding the chip (3), wherein a planar module (1) is provided having a non-conducting substrate (2) that cannot be laminated with the thermoplastic material, the chip (3) being able to be connected to said module by way of an electrically conducting film, wherein the film forms contact areas (4a, 4b) for connecting the ends (7, 8) of the antennas (6) to the chip (3) on the module (1), and wherein the thermoplastic material (5) is laminated together with the module (1) and the antenna (6) between two cover layers (9, 10) in sandwich fashion, the contact areas (4a, 4b) of said module being aligned with the ends (7, 8) of the antenna (6).
申请公布号 US8866675(B2) 申请公布日期 2014.10.21
申请号 US200912990973 申请日期 2009.03.25
申请人 SES RFID Solutions GmbH 发明人 Scattergood Martin
分类号 H01Q1/38;H01Q7/00 主分类号 H01Q1/38
代理机构 Kilpatrick Townsend & Stockton LLP 代理人 Kilpatrick Townsend & Stockton LLP
主权项 1. A spatial structure with a transponder, comprising: an antenna of a flat construction and a chip operably connected to the antenna, the antenna including two ends and being at least partially embedded in a thermoplastic sheet material of the spatial structure, wherein the thermoplastic sheet material comprises polyvinyl chloride, PETG, polycarbonate or a combination thereof and includes two major surfaces, and wherein the chip is pressed into one of the major surfaces during lamination for partially receiving the chip, a sheet module comprising a nonconducting substrate that is positioned on the thermoplastic sheet material so as to be on one of the major surfaces, the sheet module further comprising an electrically conductive film that is positioned on the nonconducting substrate and includes contact areas to which the ends of the antenna are connected to electrically couple the chip to the antenna, wherein the contact areas are also positioned on the major surface and orientated to the ends of the antenna to facilitate a connection to the ends of the antenna, wherein the substrate comprises a material that does not melt during lamination of the thermoplastic sheet material such that the substrate does not laminate with the thermoplastic sheet material, and wherein the substrate comprises PET, PI, PV or a combination thereof; and wherein the thermoplastic sheet material is positioned between two outer layers that are separate from the substrate in a sandwich-like manner together with the module during the lamination such that the contact areas of the electrically conductive film are aligned with the ends of the antenna, and the antenna between the two outer layers.
地址 Dusseldorf DE