Devices and methods for solder flow control in three-dimensional microstructures

摘要

Structures, materials, and methods to control the spread of a solder material or other flowable conductive material in electronic and/or electromagnetic devices are provided.

主权项

1. An electronic microstructure, comprising:
a mounting surface having at least a portion thereof configured to bond to one or more of a metallic solder and a conductive epoxy; a wick stop structure disposed away from the mounting surface at a location on the microstructure proximate the mounting surface, the wick stop structure configured to deter a flow of one or more of the metallic solder and the conductive epoxy from the mounting surface to a location on the microstructure beyond the location of the wick stop structure, wherein the wick stop structure comprises a shelf which extends outwardly away from a surface of the microstructure at which the shelf is located.