| 发明名称 | Semiconductor packages with integrated antenna and methods of forming thereof | ||
| 摘要 | In accordance with an embodiment of the present invention, a semiconductor package includes a substrate having a first major surface and an opposite second major surface. A first chip is disposed in the substrate. The first chip includes a plurality of contact pads at the first major surface. A via bar is disposed in the substrate. An antenna structure is disposed within the via bar. | ||
| 申请公布号 | US8866292(B2) | 申请公布日期 | 2014.10.21 |
| 申请号 | US201313736641 | 申请日期 | 2013.01.08 |
| 申请人 | Infineon Technologies AG | 发明人 | Beer Gottfried;Wojnowski Maciej;Pour Mousavi Mehran |
| 分类号 | H01L23/34;H01L23/498;H01L21/768 | 主分类号 | H01L23/34 |
| 代理机构 | Slater & Matsil, L.L.P. | 代理人 | Slater & Matsil, L.L.P. |
| 主权项 | 1. A semiconductor package comprising: a substrate having a first major surface and an opposite second major surface; a first chip disposed in the substrate, the first chip comprising a plurality of contact pads at the first major surface; a first via bar disposed in the substrate; and a first antenna structure disposed on or in the first via bar. | ||
| 地址 | Neubiberg DE | ||