发明名称 Systems and methods for a thin film capacitor having a composite high-K thin film stack
摘要 Systems and methods are provided for fabricating a thin film capacitor involving depositing an electrode layer of conductive material on top of a substrate material, depositing a first layer of ferroelectric material on top of the substrate material using a metal organic deposition or chemical solution deposition process, depositing a second layer of ferroelectric material on top of the first layer using a high temperature sputter process and depositing a metal interconnect layer to provide electric connections to layers of the capacitor.
申请公布号 US8867189(B2) 申请公布日期 2014.10.21
申请号 US201213435392 申请日期 2012.03.30
申请人 BlackBerry Limited 发明人 Zelner Marina;Capanu Mircea;Nagy Susan C.
分类号 H01G4/06;H01G4/33;H01G4/12;H01L49/02 主分类号 H01G4/06
代理机构 Guntin & Gust, PLC 代理人 Guntin & Gust, PLC ;Gust Andrew
主权项 1. A thin film capacitor prepared by a process comprising: depositing an electrode layer of conductive material on a substrate material; depositing a seed layer of ferroelectric material on the electrode layer utilizing a deposition process that forms a randomly-oriented grain structure; depositing a second layer of ferroelectric material on the seed layer using a high temperature sputter process in a manner that forms a columnar-oriented grain structure; and depositing a metal interconnect layer to provide electric connections for the capacitor.
地址 Waterloo, Ontario CA