发明名称 |
Systems and methods for a thin film capacitor having a composite high-K thin film stack |
摘要 |
Systems and methods are provided for fabricating a thin film capacitor involving depositing an electrode layer of conductive material on top of a substrate material, depositing a first layer of ferroelectric material on top of the substrate material using a metal organic deposition or chemical solution deposition process, depositing a second layer of ferroelectric material on top of the first layer using a high temperature sputter process and depositing a metal interconnect layer to provide electric connections to layers of the capacitor. |
申请公布号 |
US8867189(B2) |
申请公布日期 |
2014.10.21 |
申请号 |
US201213435392 |
申请日期 |
2012.03.30 |
申请人 |
BlackBerry Limited |
发明人 |
Zelner Marina;Capanu Mircea;Nagy Susan C. |
分类号 |
H01G4/06;H01G4/33;H01G4/12;H01L49/02 |
主分类号 |
H01G4/06 |
代理机构 |
Guntin & Gust, PLC |
代理人 |
Guntin & Gust, PLC ;Gust Andrew |
主权项 |
1. A thin film capacitor prepared by a process comprising:
depositing an electrode layer of conductive material on a substrate material; depositing a seed layer of ferroelectric material on the electrode layer utilizing a deposition process that forms a randomly-oriented grain structure; depositing a second layer of ferroelectric material on the seed layer using a high temperature sputter process in a manner that forms a columnar-oriented grain structure; and depositing a metal interconnect layer to provide electric connections for the capacitor. |
地址 |
Waterloo, Ontario CA |