Semiconductor device and method for manufacturing a semiconductor device

摘要

A semiconductor device mountable to a substrate is provided. The device includes a semiconductor package having at least one semiconductor die, an electrically conductive attachment region, and a packaging material in which is embedded the semiconductor die and a first portion of the electrically conductive attachment region contacting the die. A metallic shell encloses the embedded semiconductor die and the first portion of the electrically conductive attachment region.

主权项

1. A method of manufacturing a semiconductor device mountable to a substrate, the method comprising:
forming a semiconductor package by:
arranging a semiconductor die for electrical communication with a first attachment area of an electrically conductive attachment region;applying a dielectric, thermally conductive interlayer material to a second attachment area of the electrically conductive attachment region wherein the electrically conductive attachment region is located between the semiconductor die and the dielectric, thermally conductive interlayer material;providing a housing at least in part enclosing the die and the interlayer material;applying a thermally conductive adhesive layer to the semiconductor package; and enclosing the semiconductor package in a metallic shell,
wherein the thermally conductive adhesive layer is applied to the semiconductor package prior to enclosing the semiconductor package in the metallic shell.