| 发明名称 | Method of bonding light emitting diode (LED) for LED module and LED manufactured thereby | ||
| 摘要 | A method for bonding a light emitting diode (LED) for an LED module and a resulting LED structure are provided. The method may include preparing an LED comprising a first semiconductor layer, an active layer, and a second semiconductor layer on a substrate, applying a liquid on a mounting substrate which is oxidizable, and bonding a surface of the LED, on which a substrate is disposed, onto the mounting substrate during oxidation of the mounting substrate by the liquid. The resulting LED structure features substantially reduced thickness in a smaller overall package and one or more oxidized metallic layers exhibiting lower thermal insulation for better LED optical efficiency. | ||
| 申请公布号 | US8865488(B2) | 申请公布日期 | 2014.10.21 |
| 申请号 | US201313798007 | 申请日期 | 2013.03.12 |
| 申请人 | Samsung Electronics Co., Ltd. | 发明人 | Kim Han Hyoung |
| 分类号 | H01L33/48;H01L33/64 | 主分类号 | H01L33/48 |
| 代理机构 | Renaissance IP Law Group LLP | 代理人 | Renaissance IP Law Group LLP |
| 主权项 | 1. A method of bonding a light emitting diode (LED) for an LED module, the method comprising: preparing an LED comprising a first semiconductor layer, an active layer, and a second semiconductor layer on an LED substrate; applying a liquid on a mounting substrate which is oxidizable; and bonding a surface of the LED substrate onto the mounting substrate during oxidation of the mounting substrate by the liquid. | ||
| 地址 | KR | ||