IC manufacturing method, IC and apparatus

摘要

A method of manufacturing an integrated circuit having a substrate comprising a plurality of components and a metallization stack over the components, the metallization stack comprising a first sensing element and a second sensing element adjacent to the first sensing element.

主权项

1. An integrated circuit comprising a substrate carrying a plurality of components and a metallization stack over said plurality of components, the metallization stack comprising a first sensing element and a second sensing element adjacent to the first sensing element, the integrated circuit further comprising a patterned moisture-impenetrable layer over the metallization stack and a patterned passivation layer over the moisture-impenetrable layer, said patterned passivation layer comprising:
a void exposing the first sensing element; and a trench filled with a further moisture-impenetrable material to define a guard ring delimiting a region over the first or second sensing element, said guard ring extending through the passivation layer and the underlying moisture-impenetrable layer to a portion of the metallization stack.