Package structure having MEMS element

摘要

A package structure having at least an MEMS element is provided, including a chip having electrical connecting pads and the MEMS element; a lid disposed on the chip to cover the MEMS element and having a metal layer provided thereon; first sub-bonding wires electrically connecting to the electrical connecting pads; second sub-bonding wires electrically connecting to the metal layer; an encapsulant disposed on the chip, wherein the top ends of the first and second sub-bonding wires are exposed from the encapsulant; and metallic traces disposed on the encapsulant and electrically connecting to the first sub-bonding wires. The package structure advantageously features reduced size, relatively low costs, diverse bump locations, and an enhanced EMI shielding effect.

主权项

1. A package structure having at least a Micro Electro Mechanical System (MEMS) element, comprising:
a chip provided thereon with a plurality of electrical connection pads and the at least an MEMS element; a lid disposed on the chip to cover the MEMS element; a metal layer only disposed on a top surface of the lid and in direct physical contact with the lid; a plurality of first sub-bonding wires electrically connecting to the electrical connection pads, respectively; a plurality of second sub-bonding wires electrically connecting to the metal layer; an encapsulant disposed on the chip to cover the lid, the first sub-bonding wires and the second sub-bonding wires, wherein top ends of the first sub-bonding wires and the second sub-bonding wires are exposed from a top surface of the encapsulant; and a plurality of metallic traces disposed on the encapsulant and electrically connected to the first sub-bonding wires.