Apparatus and method of manufacturing laser diode unit utilizing submount bar

摘要

A manufacturing method of laser diode unit of the present invention includes steps: placing a laser diode on top of a solder member formed on a mounting surface of a submount, applying a pressing load to the laser diode and pressing the laser diode against the solder member, next, melting the solder member by heating the solder member at a temperature higher than a melting point of the solder member while the pressing load is being applied, and thereafter, bonding the laser diode to the submount by cooling and solidifying the solder member, thereafter, removing the pressing load, and softening the solidified solder member by heating the solder member at a temperature lower than the melting point of the solder member after the pressing load has been removed, and thereafter cooling and re-solidifying the solder member.

主权项

1. A manufacturing apparatus of laser diode units,
each of the laser diode units comprising:
a submount; anda laser diode mounted on the submount, the manufacturing apparatus comprising:
a holding stage that holds a submount bar in which a plurality of the submounts are arrayed in a row and are physically integrated and on which a plurality of solder members are arrayed in a row, a plurality of the laser diodes being respectively mounted on the plurality of the submounts, the plurality of the laser diodes including a first laser diode and a second laser diode, the plurality of the solder members including a first solder member corresponding to the first laser diode and a second solder member corresponding to the second laser diode and adjacent to the first solder member;a load application device that applies a pressing load to one of the laser diodes placed on top of the solder member and that presses the one of the laser diodes against the solder member in a state in which the submount bar is held by the holding stage;a heating device that locally heats the solder member in the state in which the submount bar is held by the holding stage; anda controller that controls the heating device and the load application device in a manner that the first solder member is locally heated and melted with the heating device and is bonded to the submount bar while the load application device applies the pressing load to the first laser diode, and thereafter, the first solder member is heated and softened as the second solder member, which has not yet bonded the second laser diode to the submount bar, is locally heated and melted with the heating device while the load application device applies the pressing load to the second laser diode.