发明名称 Optical printed circuit board and method of fabricating the same
摘要 An optical printed circuit board (PCB) and a method of fabricating the same wherein the optical PCB is mounted with an alignment pattern area whose particular area of an integral optical connection module embedded in the optical PCB is exposed, and the alignment pattern area is formed with a sill lower than a surface of the optical PCB, whereby a transmission/reception module automatically aligned via the alignment pattern area is eased to increase the alignment accuracy between an optical connection module and the transmission/reception module and to increase the efficiency of alignment.
申请公布号 US8867871(B2) 申请公布日期 2014.10.21
申请号 US201013500779 申请日期 2010.03.24
申请人 LG Innotek Co., Ltd. 发明人 Choi Jae Bong
分类号 G02B6/12;H05K1/02;G02B6/43;H01L23/00;H05K1/18;H05K3/46 主分类号 G02B6/12
代理机构 Saliwanchik, Lloyd & Eisenschenk 代理人 Saliwanchik, Lloyd & Eisenschenk
主权项 1. An optical PCB comprises: a printed circuit board including a surface, at least one inner layer, and a circuit pattern electrically connecting the inner layers; an integral optical connection module integrally formed with an optical transmission unit embedded in the primed circuit board and an optical reception unit connected to an optical waveguide; and a transmission/reception module embedded into an alignment pattern area and automatically aligned and mounted with the integral optical connection module, wherein the integral optical connection module further includes a support unit for supporting a formation portion of the optical waveguide, wherein the surface of the optical printed circuit board is formed with the alignment pattern area having a sill structure from which a partial area of the integral optical connection module is exposed, and wherein the support unit is filled with thermosetting resin to enhance structural stability.
地址 Seoul KR