发明名称 Miniaturized high speed optical module
摘要 The present disclosure relates to an optical module comprising a carrier substrate including first electrical connection terminals on a first surface and second electrical connection terminals on a second surface electrically connected to the first electrical connection terminals. The second electrical connection terminals are connectable to a circuit carrier. The optical module further comprises an optically transparent carrier including first electrical connection terminals, and an optical element electrically connected to the optically transparent carrier. The optically transparent carrier is mechanically attached and electrically connected to the carrier substrate trough corresponding first electrical connection terminals, and the optical element is connected on a first surface of the optically transparent carrier and is adapted to emit/receive light through the optically transparent carrier to/from an optical coupling element facing a second surface of the optically transparent carrier opposing the first surface.
申请公布号 US8867869(B2) 申请公布日期 2014.10.21
申请号 US201113230429 申请日期 2011.09.12
申请人 Tyco Electronics Svenska Holdings AB 发明人 Steijer Odd;Andersson Magnus;Svenson Lars-Goete
分类号 G02B6/12;G02B6/42 主分类号 G02B6/12
代理机构 Faegre Baker Daniels LLP 代理人 Faegre Baker Daniels LLP
主权项 1. An optical module to be mounted on a circuit carrier, the optical module comprising: a carrier substrate including first electrical connection terminals on a first surface thereof, second electrical connection terminals on a second surface electrically connected to the first electrical connection terminals, the second electrical connection terminals being connectable to the circuit carrier; an optically transparent carrier including first electrical connection terminals, wherein the carrier substrate includes a first opening on at least a first surface thereof and the optically transparent carrier is positioned completely within the first opening; and an optical element electrically connected to the optically transparent carrier, wherein the optically transparent carrier is mechanically attached and electrically connected to the carrier substrate within the first opening through corresponding first electrical connection terminals; wherein said optical element is connected on a first surface of the optically transparent carrier and is adapted to emit/receive light through the optically transparent carrier to/from an optical coupling element facing a second surface of the optically transparent carrier opposing said first surface; and wherein the carrier substrate has thermal characteristics similar to the thermal characteristics of the optically transparent carrier.
地址 Jaerfaella SA