Substrate, semiconductor construction, and manufacturing method thereof

摘要

A substrate includes a die-bonding zone and a glue spreading pattern. The die-bonding zone is set to bond a die. The glue spreading pattern is placed in the die-bonding zone and includes a containing space. The die is placed on the glue spreading pattern, an area of a bottom of the die is greater than an area of an opening of the glue spreading pattern, the containing room of the glue spreading pattern is filled with a glue, and the die is bonded to the substrate by means of the glue.

主权项

1. A substrate, comprising:
a die-bonding zone for bonding a die, with the die comprising a plurality of laterals; a glue spreading pattern disposed in the die-bonding zone, and the die disposed above the glue spreading pattern; and a glue disposed in the die-bonding zone to bond the die onto the die-bonding zone, wherein the glue is bonded between a bottom of the die and the glue spreading pattern; wherein the glue spreading pattern is configured to make the glue spread on the back of the die and prevent the glue overflowing to the laterals of the die.