发明名称 Nonvolatile memory device and method of manufacturing the same
摘要 A nonvolatile memory device includes gate electrodes three dimensionally arranged on a semiconductor substrate, a semiconductor pattern extending from the semiconductor substrate and crossing sidewalls of the gate electrodes, a metal liner pattern formed between the semiconductor pattern and formed on a top surface and a bottom surface of each of the gate electrodes, and a charge storage layer formed between the semiconductor pattern and the metal liner pattern.
申请公布号 US8865579(B2) 申请公布日期 2014.10.21
申请号 US201213667618 申请日期 2012.11.02
申请人 Samsung Electronics Co., Ltd. 发明人 Lee Sunwoo;Lee Sangwoo;Lee Changwon;Lee Jeonggil
分类号 H01L29/72;H01L27/115;H01L21/28 主分类号 H01L29/72
代理机构 F. Chau & Associates, LLC 代理人 F. Chau & Associates, LLC
主权项 1. A method of manufacturing a nonvolatile memory device comprising: stacking first and second insulating layers alternately on a semiconductor substrate; penetrating the first and second insulating layers to form a semiconductor pattern connected to the semiconductor substrate; forming a trench which is spaced apart from the semiconductor pattern and penetrates the first and second insulating layers; removing the second insulating layers exposed to the trench to form extension portions exposing portions of sidewall of the semiconductor pattern between vertically adjacent ones of the first insulating layers; forming metal liner patterns conformally covering an inner wall of the extension portions; and forming gate electrodes filling the extension portions in which the metal liner patterns are formed.
地址 Suwon-Si, Gyeonggi-Do KR