发明名称 |
Nonvolatile memory device and method of manufacturing the same |
摘要 |
A nonvolatile memory device includes gate electrodes three dimensionally arranged on a semiconductor substrate, a semiconductor pattern extending from the semiconductor substrate and crossing sidewalls of the gate electrodes, a metal liner pattern formed between the semiconductor pattern and formed on a top surface and a bottom surface of each of the gate electrodes, and a charge storage layer formed between the semiconductor pattern and the metal liner pattern. |
申请公布号 |
US8865579(B2) |
申请公布日期 |
2014.10.21 |
申请号 |
US201213667618 |
申请日期 |
2012.11.02 |
申请人 |
Samsung Electronics Co., Ltd. |
发明人 |
Lee Sunwoo;Lee Sangwoo;Lee Changwon;Lee Jeonggil |
分类号 |
H01L29/72;H01L27/115;H01L21/28 |
主分类号 |
H01L29/72 |
代理机构 |
F. Chau & Associates, LLC |
代理人 |
F. Chau & Associates, LLC |
主权项 |
1. A method of manufacturing a nonvolatile memory device comprising:
stacking first and second insulating layers alternately on a semiconductor substrate; penetrating the first and second insulating layers to form a semiconductor pattern connected to the semiconductor substrate; forming a trench which is spaced apart from the semiconductor pattern and penetrates the first and second insulating layers; removing the second insulating layers exposed to the trench to form extension portions exposing portions of sidewall of the semiconductor pattern between vertically adjacent ones of the first insulating layers; forming metal liner patterns conformally covering an inner wall of the extension portions; and forming gate electrodes filling the extension portions in which the metal liner patterns are formed. |
地址 |
Suwon-Si, Gyeonggi-Do KR |