| 摘要 |
<p>The present invention relates to a substrate, a substrate manufacturing method, a light emitting device package, and a method for manufacturing a light emitting device package. The substrate of the present invention comprises: a body; a circuit pattern layer which is formed on the body, and contains copper (Cu); and a first plated layer which is formed on the circuit pattern layer. According to an embodiment of the present invention, the substrate can form a high-precision circuit pattern layer thereon, and can prevent that the circuit pattern layer is oxidized thereon.</p> |
