| 摘要 |
The present invention relates to an LED package, and more specifically, to an LED package, in which an epoxy molding compound (EMC) resin and a phosphor are mixed and molded on a substrate in a single unit in order to simplify manufacturing processes and remove equipment; and to a method for manufacturing the same. According to the present invention, the manufacturing method of the LED package can reduce the manufacturing costs of the LED package and a unit price, maintain the mixed state at a uniform density during molding and curing, and consequentially, make light emitting efficiency of the phosphor very uniform while reducing interference of the phosphor, thereby enhancing the light emitting efficiency of the LED package. The LED package where the EMC resin and phosphor are molded in a single unit comprises a metal substrate which is formed into a plate shape and in which an anode terminal and a cathode terminal are formed; an LED chip which is installed at the central portion of the top surface of the metal substrate and electrically connected to the anode terminal and the cathode terminal by wires; and a mixed molding material molded on the top of the metal substrate. |
