| 摘要 |
<p>The present invention relates to a plasma processing method and a plasma processing apparatus, capable of performing a desired plasma process by gradually changing the dissociation state of plasma according as plasma processing time elapses. The present invention relates to the plasma processing method using the plasma processing apparatus which includes a plasma processing chamber which processes samples with plasma, a first high frequency power source which supplies first high frequency power for generating the plasma, and a second high frequency power source which supplies second high frequency power to a sample stand which mounts the samples. The dissociation state of the plasma is controlled to the desired dissociation state by modulating the first high frequency power with a first pulse and gradually controlling the duty ratio of the first pulse according as the plasma processing time elapses.</p> |
