SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device which can adjust a resistance value.SOLUTION: A semiconductor device manufacturing method comprises: forming a semiconductor layer on a substrate; forming an insulation film on the semiconductor layer; forming a first opening and a second opening in the insulation film; forming a conductive film on the insulation film; etching the conductive film to form wiring which contacts the semiconductor layer via the first opening; and adding a hydrogen or a noble gas to a part of the semiconductor layer exposed in the second opening. Or, the semiconductor device manufacturing method comprises: performing a plasma treatment on the part of the semiconductor layer exposed in the second opening.