| 发明名称 |
BONDED BODY OF ALUMINUM ALLOY AND COPPER ALLOY, AND BONDING METHOD FOR SAME |
| 摘要 |
A bonded body made of an aluminum alloy and a copper alloy and obtained by employing the aluminum alloy as one member to be bonded and the copper alloy as the other member to be bonded, the one bonded member and the other bonded member being bonded to each other through metallic connection, wherein the one bonded member is made of comprising an aluminum alloy containing Cu: 3.0 mass % to 8.0 mass % and Si: 0.1 mass % to 10 mass % with balance being Al and unavoidable inevitable impurities, and satisfying the chemical formula: C+2.4×S≧7.8 where C (mass %) is a Cu concentration and S (mass %) is a Si composition concentration is satisfied, and the other bonded member comprises a copper alloy having a higher solidus temperature than the one bonded member. A bonding method for the bonded body is provided. |
| 申请公布号 |
US2014308541(A1) |
申请公布日期 |
2014.10.16 |
| 申请号 |
US201214361951 |
申请日期 |
2012.11.28 |
| 申请人 |
UACJ CORPORATION |
发明人 |
Kitawaki Kotaro;Murase Takashi |
| 分类号 |
B23K31/02;B32B15/01;B23K35/38 |
主分类号 |
B23K31/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A bonded body of an aluminum alloy and a copper alloy obtained by employing the aluminum alloy as one member to be bonded and the copper alloy as the other member to be bonded, the one member and the other member being bonded to each other through metallic connection, the one member comprising an aluminum alloy containing Cu: 3.0 mass % to 8.0 mass % and Si: 0.1 mass % to 10 mass % with balance being Al and inevitable impurities, and satisfying the chemical formula: C+2.4×S≧7.8 where C (mass %) is a Cu concentration and S (mass %) is a Si composition, and the other member comprising a copper alloy having a higher solidus temperature than the one member. |
| 地址 |
CHIYODA-KU, TOKYO JP |
