Dual Interface Module and Dual Interface Card Having a Dual Interface Module Manufactured Using Laser Welding

摘要

A dual interface module comprises a substrate layer having at least two first through-holes, two contact pads on a first side of the substrate, at least two connection pads on a second side of the substrate, at least one electronic element on the second side of the substrate, an antenna pad comprising an antenna on the second side of the substrate, at least two first connection elements in the first through-holes, each first element electrically connecting one of the contact pads with one of the connection pads, at least two second connection elements, each second element electrically connecting one of the connection pads with the electronic element, and two third connection elements, each third element electrically connecting the electronic element with the antenna pad. The module can be arranged on a plastic card body or in a cavity in a plastic card body to form a dual interface card.

主权项

1. A dual interface module comprising:
a substrate layer; at least two pairs of a contact pad and a connection pad, wherein each contact pad is arranged on a first side of the substrate layer, each connection pad is arranged on a second side of the substrate layer and a first through hole is arranged in the substrate layer between each contact pad and connection pad; at least one electronic element that is arranged on the second side of the substrate layer; two soldering pads with a first side and a second side that are arranged on the second side of the substrate layer, wherein a second through hole is arranged in the substrate layer adjacent to a first side of each soldering pad; at least two first connection elements, wherein each first connection element is arranged in a first through-hole and electrically connects one of the contact pads with one of the connection pads; at least two second connection elements, wherein each second connection element electrically connects one of the connection pads with the electronic element; and two third connection elements, wherein each third connection element electrically connects the electronic element with a soldering pad.