| 摘要 |
<p>The purpose of the present invention is to provide a curable resin composition, which has excellent elongation at break, and has the low root mean square roughness and low arithmetic mean roughness of the surface of the insulating layer in the wet conditioning process, and by which a plated conductive layer having sufficient peel strength can be formed, and which has a low coefficient of linear thermal expansion. A curable resin composition comprises (A) a phenoxy resin having an anthracene structure, (B) an epoxy resin, and (C) a curing agent, wherein in the case that the total of (A) the phenoxy resin, (B) the epoxy resin, and (C) the curing agent is 100 mass%, the phenoxy resin is 1-15 mass% and an epoxy equivalent of (A) the phenoxy resin is not less than 5000.</p> |
