| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroconductive film forming composition capable of forming an electroconductive film endowed with an excellent adhesiveness to substrates and a high electroconductivity (low resistance value).SOLUTION: The provided composition for forming an electroconductive film includes (A) copper oxide particles having an average particle diameter of 50-500 nm and (B) at least one type of copper complex with a molecular weight of 1,000 or less selected from the group consisting of a formic acid-copper complex and salts of copper and acetonedicarboxylic acid or derivatives thereof, and (C) a thermoplastic polymer, where the content of the copper complex (B) is 5-30 mass% of the total mass of the copper oxide particles (A). |
