发明名称 MULTILAYER CERAMIC CAPACITOR AND BOARD FOR MOUNTING MULTILAYER CERAMIC CAPACITOR
摘要 <p>PROBLEM TO BE SOLVED: To provide a multilayer ceramic capacitor capable of restraining the generation of delamination or cracks due to a thermal shock or a mechanical shock such as stress generated due to warpage of a printed circuit board after having being mounted, while reducing noise caused by vibrations due to a piezoelectric phenomenon, and to provide a board for mounting the multilayer ceramic capacitor.SOLUTION: A multilayer ceramic capacitor includes: a ceramic body; an active layer including a plurality of internal electrodes and forming a capacity; an upper cover layer formed on an upper portion of the active layer; a lower cover layer formed on a lower portion of the active layer and having a thickness greater than that of the upper cover layer; and external electrodes formed so as to cover both end surfaces and portions of upper and lower surfaces of the ceramic body. When a distance from an end portion of the lowermost internal electrode of the active layer to an end portion of the external electrode covering a portion of a lower surface of the ceramic body is E, the shortest distance from the end portion of the external electrode to the lowermost internal electrode of the active layer is T, and a margin of the ceramic body in the longitudinal direction is F, ranges of 1.2≤E/T and 30μm≤F are satisfied.</p>
申请公布号 JP2014197572(A) 申请公布日期 2014.10.16
申请号 JP20130066030 申请日期 2013.03.27
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 PARK MN-CHOL;PARK SAN-SOO;AHN YON-GYU;YI BYON-HWA
分类号 H01G4/232;H01G2/06;H01G4/12;H01G4/30 主分类号 H01G4/232
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