| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an electronic device in which a resin for bonding a lid and a base can easily form a fillet, and which can improve moisture resistance and reduce variation in quality, and to provide a manufacturing method of the electronic device.SOLUTION: The electronic device comprises a lid 11 bonded on a substrate 3 such as a ceramic base by a resin and the inside of the lid 11 is sealed. In the manufacturing method of the electronic device, a surface roughening treatment is performed on a contact surface 1a of the lid 11 with the resin 4 to form a roughened surface having a microscopic rugged shape, and the roughened surface makes the resin 4 easy to spread, so that the resin 4 can easily form a fillet shape, and moisture resistance is improved, and quality of the electronic device is improved.</p> |
