| 摘要 |
<p>Provided is a flexible resin foam composite that can be used for design gaps, which have become extremely narrow as electronics have become thinner. A resin foam composite obtained by laminating a resin foam layer and an adhesive layer, wherein the apparent density of the resin foam layer is 0.03-0.30 g/cm3, the compressive stress during 50% compression is 5.0 N/cm2 or lower, the thickness of the adhesive layer is 0.0005 mm-0.06 mm, and the total thickness of the resin foam composite is 0.35 mm or less. The ratio of the thickness of the resin foam layer and the thickness of the adhesive layer (thickness of resin foam layer/thickness of adhesive layer) is preferably 2.1 or higher.</p> |
