LEAD FRAME, SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD OF THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a lead frame which leaves no air bubble in a solder for bonding a die pad and a semiconductor element during manufacture of a resin sealed semiconductor device, and which can inhibit wet spread of a molten solder during bonding of the die pad and the semiconductor element.SOLUTION: A lead frame comprises: a tabular die pad 11 on which a semiconductor element 31 is bonded by a solder; and leads 12 electrically connected to the semiconductor element 31. the die pad 11 including a base part 21 having a reference plane 21a and a plurality of salients 22 which are arranged so as to project from the reference plane 21a in a manner such that respective apexes are separated from each other.