| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive film-forming composition capable of forming a conductive film which is excellent in conductivity with few voids.SOLUTION: The conductive film-forming composition contains copper oxide particles (A), a copper complex (B) as a copper precursor, a thermoplastic polymer (C), and a solvent (D). A ligand contained in the copper complex (B) contains a compound represented by general formula (1). [In the formula, R, R, R, R, R, and Rare each independently a substituent selected from the group consisting of a hydrogen atom, an alkyl group, an alkoxy group, an aryl group, a heteroaryl group, an amino group, an alkylamino group, a hydroxy group, and a hydroxyalkyl group, and two or more substituents selected from R, R, R, R, R, and Rmay be bonded to each other to form a cyclic structure.] |
