发明名称 COPPER FOIL WITH CARRIER, MANUFACTURING METHOD OF COPPER FOIL WITH CARRIER, PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, COPPER CLAD LAMINATED SHEET, AND MANUFACTURING METHOD OF PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a copper foil with carrier having high adhesion force between a carrier and an ultrathin copper foil before a lamination process to an insulation base plate, and easily being peeled at a carrier/ultrathin copper foil boundary surface after the lamination process to the insulation base plate.SOLUTION: An intermediate layer of a copper foil with carrier contains nickel and chrome. E(x) is defined as E(x)=∫e(x)dx/(∫e(x)dx+∫f(x)dx+∫g(x)dx+∫h(x)dx+∫i(x)dx+∫j(x)dx+∫k(x)dx), where e(x), f(x), g(x), h(x), i(x), j(x), k(x) are atomic percentages of chrome, zinc, nickel, copper, oxygen, carbon, and others, respectively, and x (nm) is a depth into the intermediate layer for a carrier from a surface of the intermediate layer for the carrier, in the depth direction analysis. Then E(x) satisfies 1 to 30% over a section of x in a range of 0 to 1.0, when peeling according to JISC-6471 between the intermediate layer and the ultrathin copper layer. A variation coefficient of chrome concentration Xsatisfies 40.0% or less and an arithmetic mean value of 20 points of E(x) satisfies 1 to 30%, where &sgr;is a standard deviation of E(x), E(x) is measured at 10 points with 20 mm interval in a width direction and at 10 points with 20 mm interval in a longer direction, and the variation coefficient of chrome concentration Xis calculated from a formula of X=&sgr;×100/(20 points arithmetic mean value of E(x)).
申请公布号 JP2014195871(A) 申请公布日期 2014.10.16
申请号 JP20130050732 申请日期 2013.03.13
申请人 JX NIPPON MINING & METALS CORP 发明人 HONDA MISATO;NAGAURA YUTA
分类号 B32B15/01;B32B15/04;H05K1/09 主分类号 B32B15/01
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