| 摘要 |
PROBLEM TO BE SOLVED: To provide a high-quality lead frame that withstands direct bonding between an electrode of a light-emitting element and a metal member, and to provide a highly reliable light-emitting device using the lead frame.SOLUTION: In the lead frame, a plurality of units is coupled with one another and each unit includes a pair of lead portions, arranged spaced apart from and opposite to each other, for mounting thereon a semiconductor element and being electrically connected to a pair of electrodes of the semiconductor element respectively. The lead frame includes: an element mounting region which is arranged on a surface thereof and for mounting thereon the semiconductor element; and a bent groove which surrounds the element mounting region and extends, corresponding to the outer periphery of the semiconductor element, from an opposite end surface of the pair of lead portions toward a direction apart from the end surface. |
