| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an epoxy resin composition which is easy to mold/process and gives a cured product having sufficient heat resistance and thermal conductivity when cured.SOLUTION: The present invention relates to: the epoxy resin composition which contains at least an epoxy resin represented by the following formula 1; and a cured product obtained by curing the epoxy resin composition. (In the formula, Rand Reach independently represent a hydrogen atom, an alkyl group having 4 or less carbon atoms, an alkoxy group having 4 or less carbon atoms, a hydroxy group, or a halogen atom; Rrepresents a hydrogen atom, an alkoxy group having 4 or less carbon atoms, a hydroxy group, or a halogen atom; and at least one of Rand Ris not a hydrogen atom.)</p> |
