发明名称 |
METHOD OF FABRICATING HETEROJUNCTION BATTERY |
摘要 |
The present invention discloses a method of fabricating a heterojunction battery, comprising the steps of: depositing a first amorphous silicon intrinsic layer on the front of an n-type silicon wafer, wherein the n-type silicon wafer may be a monocrystal or polycrystal silicon wafer; depositing an amorphous silicon p layer on the first amorphous silicon intrinsic layer; depositing a first boron doped zinc oxide thin film on the amorphous silicon p layer; forming a back electrode and an Al-back surface field on the back of the n-type silicon wafer; and forming a positive electrode on the front of the silicon wafer. In addition, the present invention further discloses a method of fabricating a double-sided heterojunction battery. In the present invention, the boron doped zinc oxide is used as an anti-reflection film in place of an ITO thin film; due to the special nature, especially the light trapping effect of the boron doped zinc oxide, the boron doped zinc oxide can achieve good anti-reflection. Therefore, the step of texturization is removed and the fabrication process simplified. As polycrystal silicon texturization is more challenging, the present invention is of more significance to heterojunction batteries using a polycrystal silicon wafer. |
申请公布号 |
US2014308773(A1) |
申请公布日期 |
2014.10.16 |
申请号 |
US201314036542 |
申请日期 |
2013.09.25 |
申请人 |
Chint Solar (Zhejiang) Co., Ltd. |
发明人 |
NIU Xinwei;YU Cao;DING Lan;RONG Junmei;LIU Shiyong;WANG Minghua;HU Jinyan;HAN Weizhi;ZHU Yongmin;ZHANG Hua;FENG Tao;JIN Jianbo;QIU Zhanwei;YANG Liyou |
分类号 |
H01L31/20 |
主分类号 |
H01L31/20 |
代理机构 |
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代理人 |
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主权项 |
1. A method of fabricating a heterojunction battery, comprising the steps of:
a) depositing a first amorphous silicon intrinsic layer on the front of an n-type silicon wafer; b) depositing an amorphous silicon p layer on the first amorphous silicon intrinsic layer; c) depositing a first boron doped zinc oxide thin film on the amorphous silicon p layer; d) forming a back electrode and an Al-back surface field on the back of the n-type silicon wafer; e) forming a positive electrode on the front of the n-type silicon wafer. |
地址 |
Hangzhou CN |