| 摘要 |
<p>The present invention relates to a high-efficiency COB LED package, the present invention providing a high-efficiency COB LED package in which the upper surface of a metal substrate on which an LED chip is mounted is coated with a reflective plate comprising white photosensitive resist (PSR) to increase the color rendering index (CRI) and reflective efficiency of the light emitted from the LED chip, and the size of a hole on the reflective plate, for molding the LED chip, is bigger than the sized of the LED chip so as to create an extra space, so that when the LED chip is adhered to the hole, the epoxy in the hole moves into the extra space and spreads only on the lower surface of the LED chip and simultaneously rises up to the edges of the LED chip, preventing edge and surface interference of the LED chip and thus increasing the light-emitting efficiency thereof. The present invention is characterized by comprising: a metal substrate having a plate-shaped body and provided with a positive terminal and a negative terminal; a reflective plate coated on the central portion of the upper surface of the metal substrate; one or more LED chips disposed on the reflective plate and electrically connected, by a wire, to the positive terminal and the negative terminal; and a printed circuit board stacked on the edges of the upper surface of the metal substrate, wherein the printed circuit board has a hollow filling space in the middle thereof and is provided with electrode grooves for exposing one longitudinal end of each electrode.</p> |
