ENCAPSULATING STRUCTURE FOR IMPROVING VERTICAL LED CHIP LUMINANCE

摘要

Provided is an encapsulating structure for improving vertical light-emitting diode chip luminance, comprising at least one bracket system (1), one gel cup (2) connecting to the periphery of the bracket system (1), one LED chip (3) containing a light-absorbent base plate (4) and disposed on the bracket system (1), and encapsulating gel (5) distributed around the periphery of the LED chip (3), said structure characterized in that it also comprises a baffle plate (8) surrounding the outer sidewall of the light-absorbent base plate (4).The addition of a baffle plate (8) structure on the bracket system (1) of the encapsulating structure effectively avoids the absorption of light rays by light-absorbent base plates (4) in the prior art, instead reflecting light rays outside the encapsulating structure, increasing the rate of light emission and improving the light intensity of the vertical light-emitting diode chip (3).