| 摘要 |
PROBLEM TO BE SOLVED: To provide a photocurable type non-solvent composition exhibiting adhesive performance for various base materials including hard-to-bond base materials and satisfying both of speeding up and energy saving of a production process, and to provide a method for producing the same.SOLUTION: The photocurable type non-solvent composition includes: a non-solvent polymerizable copolymer composition (A), a chlorinated polypropylene (B), and a polymerization initiator (C) generating radicals by the absorption of infrared ray. The copolymer composition (A) contains a mixture of a (meth)acrylic acid ester copolymer, formed from a (meth)acrylic acid ester monomer (a) having an alkyl group with carbon atoms of 4 or more, a polymerizable monomer (b) having a nitrogen atom in the molecule, and a specific (meth)acrylic acid ester monomer (c), and the monomers (a), (b) and (c). The weight-average molecular weight (Mw) of the (meth)acrylic acid ester copolymer is 200,000-400,000, the dispersion degree represented by the ratio (Mw/Mn) of Mw to the number-average molecular weight (Mn) is 2.0-5.0, and the copolymer has polymerizable double bonds on the side chain in an amount of 3-10 mol per 1 mol of the copolymer molecule. |
