| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for manufacturing a conductive material, in which a resin layer having a specific chemical structure is formed on a substrate, and which ensures coating uniformity on the resin layer and eliminates the necessity of converting a layer containing metal fine particles, formed by being applied, into an uneven conductive film, and in which a conductive layer is laminated on an insulator substrate with sufficient adhesion strength by an easier and highly reliable method.SOLUTION: A method for manufacturing a conductive material comprises the steps of: (1) forming a resin layer on an insulator substrate by applying a resin layer forming composition on the substrate; (2) forming a non-conductive layer by applying a dispersion containing 0.5 mass% or more metal fine particles protected by a compound containing N, S, P or O on the resin layer obtained by (1); and (3) forming a conductive layer by performing electroless plating on the substrate having the non-conductive layer obtained by (2). The resin layer forming composition contains a urethane resin, a vinyl polymer, and an aqueous medium.</p> |
