DETECTION OF PLATING ON WAFER-HOLDING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide methods and apparatus for detecting whether unwanted metallic deposits are present on a bottom of a substrate holder used in an electroplating apparatus.SOLUTION: A method comprises: positioning detection hardware 106 in the proximity of a substrate holder of an electroplating apparatus, where the substrate holder is an annular element having a bottom and an interior edge, and where the substrate holder is configured to support a substrate during electroplating; and operating the detection hardware 106 to detect the presence or absence of metal deposits in a detection region on the substrate holder.