METHOD OF MANUFACTURING A SEMICONDUCTOR COMPONENT AND STRUCTURE

摘要

A semiconductor component and methods for manufacturing the semiconductor component that includes a three dimensional helically shaped common mode choke. In accordance with embodiments, a transient voltage suppression device may be coupled to the monolithically integrated common mode choke.

主权项

1. A method for manufacturing a semiconductor component, comprising:
providing a semiconductor material having a major surface; forming a first metallization system over the semiconductor material; forming a first dielectric structure over the first metallization system; forming a first template over the first dielectric structure, the template having openings that expose portions of the first dielectric structure; forming a second metallization system on the exposed portions of the first dielectric structure; forming a second dielectric structure over the second metallization system; forming a second template over the second dielectric structure, the template having openings that expose portions of the second dielectric structure; and forming a third metallization system on the exposed portions of the second dielectric structure.