HEAT DISSIPATING SEMICONDUCTOR DEVICE PACKAGES AND RELATED METHODS

摘要

An embodiment of a method for making semiconductor device packages includes a heat sink matrix and a substrate. A plurality of semiconductor devices is attached to the substrate. Then, a package body is formed between the heat sink matrix and the substrate, wherein the package body encapsulates the semiconductor devices. Then, a plurality of first cutting slots is formed, wherein the first cutting slots extend through the heat sink matrix and partially extend into the package body. Then, a plurality of second cutting slots is formed, wherein the second cutting slots extend through the substrate and through the package body to the first cutting slot, thereby singulating the heat sink matrix and substrate into a plurality of individual semiconductor device packages.

主权项

1. A method of making a plurality of semiconductor device packages, the method comprising:
arranging a plurality of semiconductor devices on a substrate; placing the substrate in apposition with a heat sink matrix, wherein the semiconductor devices are disposed between the substrate and the heat sink matrix; forming a package body between the heat sink matrix and the substrate, wherein the package body encapsulates the semiconductor devices; forming a plurality of first slots extending through the heat sink matrix and partially extending into the package body; and forming a plurality of second slots, wherein the second slots extend through the substrate and into the package body, singulating the plurality of semiconductor device packages.