Low Profile Leaded Semiconductor Package

摘要

In a semiconductor package a lead having a bottom surface coplanar with the flat bottom surface of the plastic body extends outward at the bottom of the vertical side surface of the plastic body. The result is a package with a minimal footprint that is suitable for the technique known as “wave soldering” that is used in relatively low-cost printed circuit board assembly factories. Methods of fabricating the package are disclosed.

主权项

1. A semiconductor package comprising:
a plastic body, the plastic body having a side edge; and a lead partially encased in the plastic body, the lead comprising a foot, the foot protruding outward at a bottom of a side surface of the plastic body.