发明名称 Wafer-Level Array Cameras And Methods For Fabricating The Same
摘要 A wafer-level array camera includes (i) an image sensor wafer including an image sensor array, (ii) a spacer disposed on the image sensor wafer, and (iii) a lens wafer disposed on the spacer, wherein the lens wafer includes a lens array. A method for fabricating a plurality of wafer-level array cameras includes (i) disposing a lens wafer, including a plurality of lens arrays, on an image sensor wafer, including a plurality of image sensor arrays, to form a composite wafer and (ii) dicing the composite wafer to form the plurality of wafer-level array cameras, wherein each of the plurality of wafer-level array cameras includes a respective one of the plurality of lens arrays and a respective one of the plurality of image sensor arrays.
申请公布号 US2014306308(A1) 申请公布日期 2014.10.16
申请号 US201414249091 申请日期 2014.04.09
申请人 OmniVision Technologies, Inc. 发明人 Wu Raymond;Emery Robbert
分类号 H01L27/146 主分类号 H01L27/146
代理机构 代理人
主权项 1. A wafer-level array camera, comprising: an image sensor wafer including a M×N image sensor array, M and N are positive integers; a spacer disposed on the image sensor wafer; and a lens wafer disposed on the spacer, the lens wafer including a M×N lens array, each lens of the lens wafer having the same back focal length and being disposed at the same distance from a respective image sensor of the image sensor wafer.
地址 Santa Clara CA US