发明名称 |
Wafer-Level Array Cameras And Methods For Fabricating The Same |
摘要 |
A wafer-level array camera includes (i) an image sensor wafer including an image sensor array, (ii) a spacer disposed on the image sensor wafer, and (iii) a lens wafer disposed on the spacer, wherein the lens wafer includes a lens array. A method for fabricating a plurality of wafer-level array cameras includes (i) disposing a lens wafer, including a plurality of lens arrays, on an image sensor wafer, including a plurality of image sensor arrays, to form a composite wafer and (ii) dicing the composite wafer to form the plurality of wafer-level array cameras, wherein each of the plurality of wafer-level array cameras includes a respective one of the plurality of lens arrays and a respective one of the plurality of image sensor arrays. |
申请公布号 |
US2014306308(A1) |
申请公布日期 |
2014.10.16 |
申请号 |
US201414249091 |
申请日期 |
2014.04.09 |
申请人 |
OmniVision Technologies, Inc. |
发明人 |
Wu Raymond;Emery Robbert |
分类号 |
H01L27/146 |
主分类号 |
H01L27/146 |
代理机构 |
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代理人 |
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主权项 |
1. A wafer-level array camera, comprising:
an image sensor wafer including a M×N image sensor array, M and N are positive integers; a spacer disposed on the image sensor wafer; and a lens wafer disposed on the spacer, the lens wafer including a M×N lens array, each lens of the lens wafer having the same back focal length and being disposed at the same distance from a respective image sensor of the image sensor wafer. |
地址 |
Santa Clara CA US |