SOLID-STATE LIGHTING DEVICE AND METHOD OF MANUFACTURING SAME

摘要

The present technology provides a solid-state lighting device and method of manufacturing same. The device can include a carrier substrate having registration features on a first side; light-emitting elements (LEEs) operatively coupled with the registration features; electrically conductive elements (ECEs) operatively coupled with a first side, where the ECEs operatively interconnect the LEEs; and one or more cover layers operatively coupled with the LEEs. The ECEs, furthermore, can be configured to operatively connect the LEEs to a source of power.

主权项

1. A flexible lighting device, comprising:
a carrier substrate comprising a first surface, the first surface comprising a plurality of registration features; a plurality of light emitting diode (LED) dies operatively coupled with the registration features; a plurality of electrical conductors supported by the carrier substrate, wherein:
the electrical conductors are configured to electrically connect the LED dies to a source of power, andeach LED die of the plurality of LED dies has a plurality of surfaces and a plurality of contacts, the plurality of contacts being disposed on one or more surfaces of the plurality of surfaces and forming electrical interconnections with at least a portion of the electrical conductors; and one or more cover layers operatively coupled with the carrier substrate to encapsulate the LED dies inside the registration features, wherein the electrical interconnections are disposed within portions of the lighting device that are less than a predetermined distance away from a stress-neutral plane of the lighting device.