发明名称 SEMICONDUCTOR STORAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
摘要 According to one embodiment, coupling capacitance in a state in which a first heat radiation member is arranged between parallel flat plates of a first capacitor formed by a surface of a housing opposed to one surface of a printed circuit board and the printed circuit board is smaller than coupling capacitance in a state in which an integrally formed object having a relative dielectric constant of 5.8 is arranged between the first capacitor to cover a first radiating region containing the controller and the first nonvolatile semiconductor memories.
申请公布号 US2014307382(A1) 申请公布日期 2014.10.16
申请号 US201414307288 申请日期 2014.06.17
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 MORIAI Takakatsu;EGUCHI Toyokazu;KANEKO Atsushi;OKADA Atsushi
分类号 G06F1/18 主分类号 G06F1/18
代理机构 代理人
主权项 1. A semiconductor memory device comprising: a circuit board including a circuit pattern; a nonvolatile semiconductor memory; and a connector that is capable of being coupled with a host apparatus, wherein the circuit board includes a first surface, a second surface located opposite to the first surface, a first end having the connector, a second end in which a cutout is formed, and a corner intersected with the first end and the second end, the nonvolatile semiconductor memory is mounted on the first surface, the semiconductor memory device is configured to be capable of being housed in a housing, the housing including a first side and a second side, the second side being adjacent to the first side, the housing including a coupling portion, the coupling portion being fixed to the host apparatus and located on the second side, the second side facing the second end, the connector is configured to pass through the first side of the housing, the semiconductor memory device is configured to be capable of being housed in the housing in a position in which a center axis of the first surface along a direction in which the connector connects to the host apparatus is shifted toward the second side with respect to a center axis of the housing along the direction in which the connector connects to the host apparatus, and the cutout is configured to be capable of holding, inside, a part of the coupling portion.
地址 Minato-ku JP