RESIN MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING SAME

摘要

A resin multilayer substrate (101) is provided with: a laminated body (1) formed by laminating a plurality of resin layers (2) including a first resin layer (2a); a component (3) disposed in the laminated body (1); and a connecting conductor (6) electrically connected to the component (3). Each of the resin layers (2) is a thermoplastic resin layer. The first resin layer (2a) extends from one side of the component (3) to the other side of the component (3) via the upper side or the lower side of the component (3).