| 摘要 |
<p>Across the entire surface of a distribution area for a plurality of semiconductor elements, which are formed on a semiconductor substrate, a plurality of sealing sheet pieces of areas smaller than the distribution area and which are cut in accordance with scribe lines surrounding the plurality of the semiconductor elements, are attached. A semiconductor substrate (W), in which the sealing layer is cured so as to seal the semiconductor elements therein, is held in a ring frame via dicing tape and subsequently transported to a dicing step, cut along the scribe lines, and the dicing tape is expanded so as to manufacture a semiconductor device.</p> |
