NONDESTRUCTIVE INSPECTION DETERMINATION DEVICE, DETERMINATION METHOD AND PROGRAM

摘要

PROBLEM TO BE SOLVED: To provide a nondestructive inspection determination device, a determination method and a program that are capable of reducing a detection error caused by a component mounting position on a substrate even when X-ray inspection is performed on an electronic component.SOLUTION: A determination device 200 determines the degree of reliability of an inspection result when nondestructive inspection is performed on an electronic circuit substrate that has a first surface where an electrode of an electronic component and a first circuit are joined together at a joint part and a second surface having a second circuit. The determination device 200 comprises: a locus computing section 201 for computing a locus projected on the second surface side at a constant angle from an observation point in the joint part; and an overlapping determination section 202 for evaluating the nondestructive inspection on the basis of an overlapping portion of the locus and the second circuit.