发明名称 Low Temperature Co-Fired Ceramic System on Package for Millimeter Wave Optical Receiver and Method of Fabrication
摘要 The present disclosure relates to a multi-layered low temperature co-fired ceramic (LTCC) system on package (SoP) for a millimeter wave optical receiver comprising a top layer, a plurality of first intermediate layers, a plurality of second intermediate layers, and a bottom layer. The top layer further comprises a matching network, passive components, and a signal line disposed on a substrate material, the plurality of first intermediate layers further comprises active amplification components, via holes and a plurality of inner grounding planes that are respectively disposed on a first plurality of LTCC substrates, the plurality of second intermediate layers further comprises a plurality of grounding planes that are respectively disposed on a second plurality of LTCC substrates; and the bottom layer further comprises a grounding plane that is disposed on the bottom surface of the second plurality of LTCC substrates. A method of fabricating the multi-layered LTCC SoP is also described.
申请公布号 US2014306111(A1) 申请公布日期 2014.10.16
申请号 US201414247133 申请日期 2014.04.07
申请人 Telekom Malaysia Berhad 发明人 Mohd Shapee Sabrina;Mohamed Yusoff Mohd Zulfadli;Ibrahim Azmi;Alias Rosidah;Saad Muhammad Redzuan;Ambak Zulkifli
分类号 G01J5/10;H01L31/18 主分类号 G01J5/10
代理机构 代理人
主权项 1. A multi-layered low temperature co-fired ceramic (LTCC) system on package (SoP) for a millimeter wave optical receiver comprising: a top layer; a plurality of first intermediate layers; a plurality of second intermediate layers; and a bottom layer, wherein: the top layer further comprises a matching network, passive components, and a signal line disposed on a substrate material, the plurality of first intermediate layers further comprises active amplification components, via holes, and a plurality of inner grounding planes that are respectively disposed on a first plurality of LTCC substrates, the plurality of second intermediate layers further comprises a plurality of grounding planes that are respectively disposed on a second plurality of LTCC substrates, and the bottom layer further comprises a grounding plane that is disposed on the bottom surface of the second plurality of LTCC substrates.
地址 Kuala Lumpur MY