发明名称 |
Low Temperature Co-Fired Ceramic System on Package for Millimeter Wave Optical Receiver and Method of Fabrication |
摘要 |
The present disclosure relates to a multi-layered low temperature co-fired ceramic (LTCC) system on package (SoP) for a millimeter wave optical receiver comprising a top layer, a plurality of first intermediate layers, a plurality of second intermediate layers, and a bottom layer. The top layer further comprises a matching network, passive components, and a signal line disposed on a substrate material, the plurality of first intermediate layers further comprises active amplification components, via holes and a plurality of inner grounding planes that are respectively disposed on a first plurality of LTCC substrates, the plurality of second intermediate layers further comprises a plurality of grounding planes that are respectively disposed on a second plurality of LTCC substrates; and the bottom layer further comprises a grounding plane that is disposed on the bottom surface of the second plurality of LTCC substrates. A method of fabricating the multi-layered LTCC SoP is also described. |
申请公布号 |
US2014306111(A1) |
申请公布日期 |
2014.10.16 |
申请号 |
US201414247133 |
申请日期 |
2014.04.07 |
申请人 |
Telekom Malaysia Berhad |
发明人 |
Mohd Shapee Sabrina;Mohamed Yusoff Mohd Zulfadli;Ibrahim Azmi;Alias Rosidah;Saad Muhammad Redzuan;Ambak Zulkifli |
分类号 |
G01J5/10;H01L31/18 |
主分类号 |
G01J5/10 |
代理机构 |
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代理人 |
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主权项 |
1. A multi-layered low temperature co-fired ceramic (LTCC) system on package (SoP) for a millimeter wave optical receiver comprising:
a top layer; a plurality of first intermediate layers; a plurality of second intermediate layers; and a bottom layer, wherein: the top layer further comprises a matching network, passive components, and a signal line disposed on a substrate material, the plurality of first intermediate layers further comprises active amplification components, via holes, and a plurality of inner grounding planes that are respectively disposed on a first plurality of LTCC substrates, the plurality of second intermediate layers further comprises a plurality of grounding planes that are respectively disposed on a second plurality of LTCC substrates, and the bottom layer further comprises a grounding plane that is disposed on the bottom surface of the second plurality of LTCC substrates. |
地址 |
Kuala Lumpur MY |