SEMICONDUCTOR DEVICE

摘要

The semiconductor device includes a semiconductor element, a main lead and a resin package. The semiconductor element includes an obverse surface and a reverse surface spaced apart from each other in a thickness direction. The main lead supports the semiconductor element via the reverse surface of the semiconductor element. The resin package covers the entirety of the semiconductor element. The resin package covers the main lead in such a manner that a part of the main lead is exposed from the resin package. The semiconductor element includes a part that does not overlap the main lead as viewed in the thickness direction.

主权项

1. A semiconductor device comprising:
a semiconductor element including an obverse surface and a reverse surface spaced apart from each other in a thickness direction; a main lead supporting the semiconductor element via the reverse surface; and a resin package covering the semiconductor element and the main lead; wherein the main lead is exposed from the resin package, and the semiconductor element includes a part that does not overlap the main lead as viewed in the thickness direction.