| 发明名称 |
SILICON SUBSTRATE MEMS DEVICE |
| 摘要 |
A MEMS device includes a silicon substrate. The silicon substrate includes a plurality of dielectric material grooves spaced apart from each other. The silicon substrate also includes a through hole with a portion of the through hole being located between the plurality of dielectric material grooves when viewed from a direction perpendicular to a surface of the silicon substrate. |
| 申请公布号 |
US2014306301(A1) |
申请公布日期 |
2014.10.16 |
| 申请号 |
US201313860560 |
申请日期 |
2013.04.11 |
| 申请人 |
Xie Yonglin;Ellinger Carolyn R.;Evans Mark D.;Jech, JR. Joseph |
发明人 |
Xie Yonglin;Ellinger Carolyn R.;Evans Mark D.;Jech, JR. Joseph |
| 分类号 |
B81B3/00 |
主分类号 |
B81B3/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A MEMS device comprising:
a silicon substrate including a surface, the silicon substrate including a plurality of dielectric material grooves spaced apart from each other, the silicon substrate including a through hole, a portion of the through hole being located between the plurality of dielectric material grooves when viewed from a direction perpendicular to the surface of the silicon substrate. |
| 地址 |
Pittsford NY US |
